Trade News Archives - Página 45 de 94 - TECNOLOGÍA ALCANTA(SHENZHEN)CO., LTD - Página 45

Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 a 18 capas,

Top 10 Packaging Substrate Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 capa a 20 capas.

Global Packaging Substrate Manufacturer. Podemos producir el mejor lanzamiento de Samllest Bump con 100um, La mejor traza más pequeña son 9um.

Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 capa a 20 capas.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.