Semiconductor BGA substrates Manufacturer
Semiconductor BGA substrate Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace and spacing packaging substrate
Semiconductor IC substrate Manufacturer
Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 a 18 capas
Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Substrate Packaging Manufacturer
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 a 18 capas,
Top 10 Packaging Substrate Manufacturer
Top 10 Packaging Substrate Manufacturer, Producimos principalmente sustratos de paso ultrapequeño., ultra-small trace packaging substrate from 2~20L
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