Trade News Archives - Page 56 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 56

BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

We are a professional FCBGA package, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Packaging Substrate. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.