What is FCBGA packaging technology?
We are a professional FCBGA Packaging, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.
What is FCBGA Package?
We are a professional FCBGA package, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.
What is the definition of FCBGA Package Substrate?
FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.
Have You Wondered What Packaging Substrate Really Is?
Packaging Substrate. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,
What is a Flip Chip Package Substrate?
Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.
What is a Substrate package technology development Inte ?
We are a professional Substrate package technology development Inte, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com