Flip Chip Package Substrate Manufacturer
Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 слой в 18 слои. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.
What are the advanced packaging processes?
What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 слой в 18 layer
Flip Chip Package Substrate Technology
Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. или 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…
Ultra-Small Pitch Substrate
Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!
Advanced Package Substrate
Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 слой в 18 слои. our company asways made the 10…
Waht’s the MSAP and SAP Processes?
Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) and Semi-Additive Processes (SAP). To do the traces/spacing with 9um/9um FC BGA packaging substrates.These groundbreaking methodologies have revolutionized PCB production, offering unparalleled capabilities that propel the industry to new heights of innovation and efficiency.
Тел.: +86 (0)755-8524-1496
Электронная почта: info@alcantapcb.com