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In the rapidly developing electronics field, the importance of organic substrate packaging cannot be ignored. As a core component of electronic equipment, it affects performance, reliability and cost. Organic substrate packaging provides a solid foundation for our devices, allowing us to rely on a variety of innovative electronic products in…

The FCBGA (Массив сетки Flip Chip Ball) Упаковка подложка является ключевым компонентом этой технологии и играет незаменимую роль. Подложка упаковки FCBGA обеспечивает очень интегрированное решение, которое может достичь большего количества функций, Более высокая производительность и снижение потребления энергии в миниатюрных электронных устройствах. This compact packaging method not only…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 слой в 18 слои. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 слой в 18 layer

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Такой как: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. или 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!