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FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 слой в 16 слои. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 слои. The substrates base(основной) materials are the BT base materials. ABF base materials. High frequency and high speed materials. и другие. Our company offer high quality…

Производство подложек для упаковки флип-чипов. 90% нашего производственного оборудования было закуплено в Японии. Мы используем современное производственное оборудование для производства подложек со сверхмалым расстоянием.. Такой как: 10 Слой Пакет Подложки. 12 Подложки пакета слоев. 18 Слой Пакет Подложки. Если спецификация схемы вашей подложки, it is easier to produce a…

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 слой в 18 слои. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.

FC-BGA Substrates manufacturer. we have poroduced FC-BGA Substrates from 4 слой в 14 слои. when we use the ABF base materials with the Sap technology. we can produce the substrates with 15um /15um gap and trace. In today's world, electronic devices have become an integral part of our lives. From smartphones…