Trade News Archives - Pagina 67 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 67

Substrati FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

Megtron 7 Fornitore di PCB,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(Ge)/R-5680(Ge), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Non so) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(Ge) E…

Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35uno). we offer the smallest Pads Pitch with 160um(7.1mil). Such as FCBGA packaging products.

Circuiti Ro4350B,Ro4350B PCB Supplier, Rogers 4350B PCB fabrication. Dk of 3.48 +/- 0.05, Dissipation factor of 0.0037 at 10 GHz, Fast shipping time. and more cheap price Rogers 4350b PCB Manufacturer.

Scheda elettronica Rogers 4003C, Ro4003C PCB. Ro4003C Circuits.Material reference: Dk of 3.38 +/- 0.05,Dissipation factor of 0.0027 at 10 GHz. High quality Rogers PCB fabrication. More lower cost. and the shipping time is fast.

Ro4350B PCB, Rogers 4350B PCB Manufacturing. Dk of 3.48 +/- 0.05, Dissipation factor of 0.0037 at 10 GHz, High quality Rogers PCB Supplier. Fast shipping time. and Low cost. we will help you save time.