Ceramic PCB Fabrication

ceramic-pcb-fabrication

Ceramic Fabricación de PCB. Addressing the unique challenges of satellite power supply design, curamik® ceramic substrates excel in demanding applications that require a long lifetime, high reliability and robustness. Si3N4 ceramic substrates, for example, carry higher currents and provide higher voltage isolation. They operate over a wide temperature range. Además, the different metal layers are combined hermetically using the curamik bonding process. We are the Ceramic PCB manufacturer in China.

In space, malfunction or failure as that may jeopardize an entire mission as power electronics cannot be repaired or replaced. Radiation and the absence of atmosphere and gravity make it necessary to use radiation-hardened components that dissipate heat by conduction and radiation only. Special provisions are required to prevent damage and provide reliable, long-term, unattended operation when it comes to designing how satellites are powered.

The high heat conductivity, along with the high heat capacity and thermal spreading of the thick copper cladding, makes curamik substrates indispensable to power electronics, particularly for mission-critical applications like satellite power management.

curamik® Performance

• Basado en Si₃norte₄ Cerámica y producida en Active Metal Brazed. (CON) proceso
• Utilizado en aplicaciones donde la vida útil es larga., Se requieren alta densidad de potencia y robustez.
• Ofrece conductividad térmica de 90 W/mK a 20°C
• Disponible en 6 combinaciones de espesores
• CTE de 2.5 ppm/K a 20°C – 300°C

curamik® Power

• Alabama₂oh₃ provides best price-performance ratio
• Offers sufficient thermal and mechanical properties for the most common applications
• Ofrece conductividad térmica de 24 W/mK a 20°C
• Disponible en muchas combinaciones de espesor
• CTE de 6.8 ppm/K a 20°C – 300°C

curamik® Power Plus

• HPS substrates provide enhanced robustness through Zr doped Al₂oh₃ ceramics
• Used in medium power output applications
• Ofrece conductividad térmica de 26 W/mK a 20°C
• Disponible en muchas combinaciones de espesor
• CTE de 7.1 ppm/K a 20°C – 300°C

curamik® Thermal

• Based on AlN ceramics and combines excellent thermal conductivity with good mechanical stability
• Used in very high operational voltage and power density applications
• Ofrece conductividad térmica de 170 W/mK a 20°C
• Disponible en muchas combinaciones de espesor
• CTE de 4.7 ppm/K a 20°C – 300°C

Si tienes alguna pregunta, no dude en contactarnos coninfo@alcantapcb.com , estaremos encantados de ayudarle.