High Frequency Circuit Materials
We buy these materials from an agent at Rogers Materials and then process and produce blank circuit boards. We don’t produce core materials. The following information is for reference only.
RO4003™ laminates are currently offered in various confifi gurations utilizing both 1080 and 1674 glass fabric styles, with all confifi gurations meeting the same laminate electrical performance specififi cation.
as a drop-in replacement for the RO4003C™ material, RO4350B™ laminates utilize RoHS compliant flfl ame-retardant technology for applications requiring UL 94V-0 certififi cation. These materials conform to the requirements of IPC- 4103, slash sheet /10 for RO4003C and /11 for RO4350B materials.
|Dielectric Constant, er|
3.38 ± 0.05
(2)3.48 ± 0.05
|(1) Dielectric Constant, er|
|3.55||3.66||Z||—||8 to 40 GHz||Differential Phase Length Method|
|Dissipation Factor tan, d||0.0027|
|Thermal Coefficient of er||+40||+50||Z||ppm/°C||-50°C to 150°C||IPC-TM-650 184.108.40.206|
|Volume Resistivity||1.7 X 1010||1.2 X 1010||MΩ•cm||COND A||IPC-TM-650 220.127.116.11|
|Surface Resistivity||4.2 X 109||5.7 X 109||MΩ||COND A||IPC-TM-650 18.104.22.168|
|Z||KV/mm (V/mil)||0.51mm (0.020”)||IPC-TM-650 22.214.171.124|
|Tensile Modulus||19,650 (2,850)|
|X Y||MPa (ksi)||RT||ASTM D638|
|Tensile Strength||139 (20.2)|
|X Y||MPa (ksi)||RT||ASTM D638|
|MPa (kpsi)||IPC-TM-650 2.4.4|
|Dimensional Stability||<0.3||<0.5||X,Y||mm/m (mils/inch)||after etch|
|Coefficient of Thermal Expansion||11|
|X Y Z|| |
-55 to 288°C
|Tg||>280||>280||°C DSC||A||IPC-TM-650 2.4.24|
|Td||425||390||°C TGA||ASTM D3850|
|Thermal Conductivity||0.71||0.69||W/m/°K||80°C||ASTM C518|
|48 hrs immersion|
0.060” sample Temperature 50°C
|Copper Peel Strength||1.05|
|N/mm (pli)||after solder float 1 oz. EDC Foil||IPC-TM-650 2.4.8|
|Lead-Free Process Compatible||Yes||Yes|
High frequency PCB with Rogers material The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component. Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control. Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (εr) of the materials used.
ALCANTA PCB has bought these materials from an agent at Rogers Materials and then process and produce blank circuit boards.
Materials used for HF circuit boards:
High-frequency boards, e.g. for wireless applications and data rates in the upper GHz range have special demands on the material used: Adapted permittivity Low attenuation for efficient signal transmission Homogeneous construction with low tolerances in insulation thickness and dielectric constant For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent. Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate. We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Impedance Check: The impedance defined by the customer is tested by our CAM station engineers on manufacturability. Depending on the layer buildup, the PCB layout and the customer’s requested impedances a calculation model is chosen. The result is any required modification of the layer builduo and the necessary adjustments to the relevant conductor geometries. After the manufacture of high frequency circuit boards, the impedances are checked (with a precision of up to 5%), and the detailed results are recorded exactly in a test protocol.