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RO4003C™/RO4350B™/RO4835™ Laminates Circuit Processing Guidelines:
These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4003C™, RO4350B™ and RO4835™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.
Storage: Fully clad RO4003C, RO4350B and RO4835 laminates should be stored at room temperature (between 50-90°F/ 10-32°C). A first-in-first-out inventory system and a method to track material lot numbers through PWB processing and delivery of finished circuits is recommended.
INNER LAYER PREPARATION:
Tooling: RO4003C, RO4350B land RO4835 laminates are compatible with many pinned and pinless tooling systems. Choosingwhether to use round or slotted pins, external or internal pinning, standard or multiline tooling, and pre vs. post-etch punching would depend on the capabilities and preferences of the circuit facility and final registration requirements. In general, slotted pins, a multiline tooling format, and post-etch punching will meet most needs.
Surface Preparation for Photoresist Processing and Copper Etching: Depending upon RO4003C, RO4350B and RO4835 core thickness, copper surfaces can be prepared for photo imaging using chemical or mechanical processes. Thinner cores should be prepared using a chemical process consisting of cleaning, micro-etching, water rinsing, and drying steps. Thicker RO4003C, RO4350B and RO4835 cores are compatible with mechanical scrub systems.
RO4003C, RO4350B and RO4835 materials are compatible with most liquid and dry film photo-resists and, once patterned, can be processed through develop, etch, and strip (DES) systems typically used to process FR-4 materials.
Oxide Treatment: RO4003C, RO4350B and RO4835 cores can be processed through any copper oxide or oxide alternative process in preparation for multi-layer bonding. The best treatment choice is typically the one recommended in the guidelines supporting the chosen prepreg or adhesive system.
Multi-Layer Bonding: RO4003C, RO4350B and RO4835 laminates are compatible with many thermosetting and thermoplastic adhesive systems. Guidelines for the adhesive system should be consulted for bond cycle parameters
Drilling Considerations: Standard entry (aluminum or thin pressed phenolic) and exit (pressed phenolic or fiber board) materials can be used when drilling RO4003C, RO4350B and RO4835 cores or bonded assemblies in one-up or multi-up stacks.
RO4003C, RO4350B and RO4835 materials are compatible with a broad range of drilling parameters. However, drilling speeds greater than 500 surface feet per minute (SFM) should be avoided. Chip loads greater than 0.002”/” are recommended for mid-range and large diameter tools while lower chiploads (<0.002”/”) are recommended for small (<0.0135”) diameter drills. In general, standard geometry drills are preferred over undercut styles as they more effectively evacuate debris from the holes during the drilling process. Hit counts.