About
Contact
|
English
العربية
Français
Deutsch
Italiano
日本語
한국어
Português
Română
Русский
Español
Kiswahili
ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com
Menu
Home
Products
PCB Fabrication
HDI PCB
Metal PCB
Rigid-Flex PCB
Embedded Cavity PCB
ABF Package Substrates
FC-CSP Substrates
Module Substates
SHDBU Substrates
IC Substrate
CPCORE Substrate
FC-BGA substrates
High Frequency&High Speed PCB
Capabilities
Overview
Multilayer PCB Fabrication
PCB Expedited Service
PCB Panels
PCB Materials
Layer Stackup
Made in the China
Offshore PCB capabilities
Fast turnarounds
PCB Specials
Premier Customer Service
News
Company News
Notification
Trade News
Contact Us
Tag Archive for "Multi-Chip FC-BGA Package Substrates Manufacturer"
Home
Multi-Chip FC-BGA Package Substrates Manufacturer
July 21, 2024
Multi-Chip FC-BGA Package Substrates Manufacturer
June 13, 2024
Multi-Chip FC-BGA Package Substrates Manufacturer
Henrychinasz
8615014077679
ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD
