Global package Substrate Manufacturer
Global package Substrate Manufacturer. Produzione di substrati per imballaggi in materiale ad alta velocità e ad alta frequenza. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, produciamo principalmente substrati a passo d'urto ultra-piccoli, ultra-small trace and PCBs from 4 strato a 20 strati.
Produttore globale di substrati per semiconduttori
Produttore globale di substrati per semiconduttori. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
CPCORE Structure Manufacturer
CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 A 18 strati.FC-CSP Substrates Manufacturer
FC-CSP Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
High Speed package Substrate Manufacturer
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com