Semiconductor FC-BGA substrate Manufacturer
Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.
Semiconductor BGA substrates Manufacturer
Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate
Semiconductor IC substrate Manufacturer
Semiconductor IC substrate Manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.
Ceramic package substrate Manufacturer
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 strati
Substrate package Manufacturer
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Substrate Packaging Manufacturer
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 strati,
tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com