Company News Archives - Page 45 of 86 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Page 45

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 strato a 20 strati.

Global Packaging Substrate Manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 strato a 20 strati.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.

Module Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs from 4 strato a 20 strati.