Company News Archives - Page 58 of 86 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 58

RT-Duroid 6035 PCB, RT 6035 PCB Fabrication, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler…

oid® 5880 PCB, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 layer to 20 layers. HDI RT5870 materials, RT5880 materials. RT 6002 materials, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.

BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 layer to 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.

FC-BGA substrates (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

Megtron 7 PCB Supplier,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) and…

Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35um). we offer the smallest Pads Pitch with 160um(7.1mil). Such as FCBGA packaging products.