أرشيف الأخبار - صفحة 22 ل 101 - تقنية الكانتا(شنتشن)المحدودة - صفحة 22

ABF GX92R Package Substrates Manufacturer.ABF GX92R Package Substrates Manufacturer specializes in the production of advanced ABF substrates designed for high-performance semiconductor packaging. Our expertise lies in crafting substrates that ensure superior electrical connectivity and thermal management, meeting the rigorous demands of modern electronics.

Ultra-thin CPU BGA Substrates Manufacturer."Ultra-thin CPU BGA Substrates Manufacturer" refers to a company specializing in the production of ultra-thin Ball Grid Array (بغا) substrates for CPUs. They focus on creating thin, high-density interconnect solutions that enhance performance and efficiency in electronic devices.

Aviation PCB Manufacturer."Aviation PCB Manufacturer" refers to a company specializing in the design and production of printed circuit boards (مركبات ثنائي الفينيل متعدد الكلور) tailored specifically for aviation applications. These PCBs are engineered to meet stringent industry standards for reliability, متانة, and performance in aviation electronics, ensuring safe and efficient operation in aerospace systems.

FC-LGA Package Substrates Manufacturer.As a leading FC-LGA Package Substrates manufacturer, we specialize in producing high-quality substrates designed for Flip Chip Land Grid Array (FC-LGA) التطبيقات. Our advanced manufacturing processes ensure optimal performance, superior thermal management, and reliable interconnectivity for high-performance computing, الاتصالات السلكية واللاسلكية, والالكترونيات الاستهلاكية. We are committed to innovation…

Chip Package Substrates Manufacturer."الشركة المصنعة لركائز حزمة الرقاقة" refers to a company specializing in the production of advanced substrates used in chip packaging. They design and manufacture these substrates to ensure optimal performance, مصداقية, and miniaturization in electronic devices.

الشركة المصنعة لركيزة IC فائقة الرقة."الشركة المصنعة لركيزة IC فائقة الرقة" متخصصة في إنتاج ركائز رفيعة وعالية الأداء بشكل استثنائي للدوائر المتكاملة (المرحلية). تضمن عمليات التصنيع المتقدمة لدينا الدقة والموثوقية, تلبية متطلبات تطبيقات الإلكترونيات المتطورة.