أرشيف الأخبار - تقنية الكانتا(شنتشن)المحدودة

Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (ثنائي الفينيل متعدد الكلور). IC substrates provide electrical connections, الدعم الميكانيكي, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…

The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, AI, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, الإدارة الحرارية, and miniaturization. As a result, Custom Glass Class Package Substrate…

إطار الرصاص QFN/QFP مخصص هو إطار معدني متخصص مصمم لتوفير اتصالات كهربائية, الدعم الميكانيكي, والتبديد الحراري لأجهزة أشباه الموصلات باستخدام QFN (رباعية شقة لا الرصاص) أو QFP (حزمة مسطحة رباعية) التغليف. تم تصميم هذه الإطارات الرئيسية لتلبية متطلبات تصميم وأداء محددة, ضمان الوظيفة المثلى في…

Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (Flip-Chip Ball Grid Array) التغليف, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…

Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (المرحلية) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…

The Small Outline Integrated Circuit (ثانية) is a compact, surface-mount technology (SMT) package widely used in the electronics industry. Known for its small size and ease of assembly, SOIC is ideal for space-constrained applications like consumer electronics, automotive systems, and communication devices. It offers a balance between functionality and cost-effectiveness,…