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Glass Package Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4,

Ultra-thin hard PCB Manufacturer. the finished boards thickness are from 3mil(0.07mm), 0.1mm, 0.12mm, 0.15mm, 0.17mm to 0.3mm. Rigid core(base) materials Ultra-thin PCBs Vendor. Such as: High TG FR4 materials, BT materials, and other High speed and high frequency materials. we use this types hard core to produce the Ultra-thin boards…

Rogers RT5880 High Frequency PCB Manufacturer. For the Antenna, Radar, Aviation, Rogers RT5880 PCB Vendor. We offer Rogers 5880 PCB with Mixed dielectric layer, Cavity, embedded Cavity Rogers PCBs. We have made this types Rogers PCBs from 2 layer to 30 layers. High quality and fast shipping time.

Wire Bonding BGA substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging. BGA/IC wire bonding. the High frequency and high frequency materials Wire Bonding BGA substrates.

Mini led PCB Substrate Manufacturer. The Ultra-small spacing LED PCBs will be made with BT core materials. the pads go pads gap tolerance will be more easy to control, and the finished boards will be more flat. we can use the High speed and high frequency material to do the…

RO4350B PCB | High frequency PCB Manufacturer, Rogers mixed media PCB production. Microtrace Ro4350B and FR4 mixed dielectric layer. We can produce this types Rogers HDI PCBs from 4 layer to 30 layers. Small trace, small gap, Blind via holes and buried via holes.