News Archives - Page 35 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 35

Alumina PCB |Al2O3 PCB Manufacturer. High speed and high frequency material PCBs, and BGA packaging substrate Manufacturer. Advanced packaging substrate production technology.

Microtrace RF PCB Manufacturer, we mainly produce Microtrace HDI PCBs, Microtrace RF PCBs and Microtrace RF BGA substrates from 2 layer to 20 layers, the best samllest trace and gap are 9um.

Military circuit board Manufacturer. High speed and high frequency material Military HDI PCBs production, We offer IPC Class III Military boards from 2 layer to 50 layers.

Radar HF substrate Manufacturer, we mainly produce ultra-small bump pitch Radar HF substrate from 2 layer to 30 layers, ultra-small trace and spacing BGA packaging substrate or HDI PCBs.

Glass Package Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4,

Ultra-thin hard PCB Manufacturer. the finished boards thickness are from 3mil(0.07mm), 0.1mm, 0.12mm, 0.15mm, 0.17mm to 0.3mm. Rigid core(base) materials Ultra-thin PCBs Vendor. Such as: High TG FR4 materials, BT materials, and other High speed and high frequency materials. we use this types hard core to produce the Ultra-thin boards…