News Archives - Page 33 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 33

Microwave/Microtrace PCB Manufacturer. HDI PCBs, and BGA packages substrates supplier, the HDI Boards and Package Substrate will be made with High speed and High-frequency materials.or other types base materials.

Microtrace Substrate Manufacturer. Microgap DHI PCBs and Microtrace BGA substrates supplier, To use the High speed and high frequency materials, We offer Microtrace BGA substrates and HDI PCBs from 2 layer to 50 layers.

Military Substrate Manufacturer. High speed and High frequency material packaging substrate or HDI PCBs Manufacturer. Advanced, dedicated military circuit board production line, strict quality standards IPC Class 3.

RF Modules Substrate Manufacturer. High frequency and High speed material packaging substrate production. We offer advanced microtrace RF packaging substrate from 2 layer to 30 layers.

Metal Core PCB Manufacturer, Super-thick Copper PCBs, Heavy copper PCBs, and thicker Metal base PCBs manufacture, we offer Metal core PCB and Aluminium base from 1 layer to 30 layers.

Microtrace BGA substrates Manufacturer. Microtrace and Microgap HDI PCBs production, We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 2 to 30 layers.