News Archives - Page 31 of 96 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 31

RF High Frequency Flip Chip Substrate Manufacturer. we can produce the best smallest bump pitch with 100um, the best smallest trace are 9um.

Military PCB Manufacturer. IPC Class III(3) PCB production, We Offer High quality HDI Military PCBs from 2 layer to 50 layers, We have a number of professional military electronic products production line.

Microtrace LED PCB Manufacturer. The LED PCB will be made with microtrace and microgap, we use the High TG Core materials to prdouce the smallest gap LED PCBs from 2 layer to 30 layers. the best smallest gap are about 30um to 60um.

BT Laminate substrate Manufacturer. High speed and High TG resinous material, We use the BT material to produce the microtrace LED PCBs, and BGA/IC package substrates from 2 layer to 22 layers.

Alumina PCB |Al2O3 PCB Manufacturer. High speed and high frequency material PCBs, and BGA packaging substrate Manufacturer. Advanced packaging substrate production technology.

Microtrace RF PCB Manufacturer, we mainly produce Microtrace HDI PCBs, Microtrace RF PCBs and Microtrace RF BGA substrates from 2 layer to 20 layers, the best samllest trace and gap are 9um.