News Archives - Page 30 of 96 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 30

Military Substrate Manufacturer. High speed and High frequency material packaging substrate or HDI PCBs Manufacturer. Advanced, dedicated military circuit board production line, strict quality standards IPC Class 3.

RF Modules Substrate Manufacturer. High frequency and High speed material packaging substrate production. We offer advanced microtrace RF packaging substrate from 2 layer to 30 layers.

Metal Core PCB Manufacturer, Super-thick Copper PCBs, Heavy copper PCBs, and thicker Metal base PCBs manufacture, we offer Metal core PCB and Aluminium base from 1 layer to 30 layers.

Microtrace BGA substrates Manufacturer. Microtrace and Microgap HDI PCBs production, We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 2 to 30 layers.

Ultrathin LED PCB Manufacturer. 1 layer or 2 layer PCBs finished boards thickness are 3mil(75um), 4mil(100um) to 6mil to 8mil, the 4 layer PCBs will be finsihed with 7mil to 15mil. or more thicker.

Ro3006 PCB Manufacturer. Rogers Series material PCB and Mixed medium Rogers PCBs production, We offer High Frequency PCBs. Such as: Ro3003, Ro3006,  Ro3010,Ro4360G2, Ro4835, Ro 4350B, Ro5880, and other types High Frequency boards, like: CLTE, Genclad, RF35,FastRise27,TLC, TLX, TLY, Taconic 601, 602, 603, 605.