Archivi di notizie - Pagina 50 Di 101 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 50

CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 A 18 strati.

FC-CSP Substrates Manufacturer. il Package Substrate sarà realizzato con materiali Showa Denko e Ajinomoto High speed. or other types base materials.

High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.

SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 A 20 strati.

Produttore di substrati per imballaggi ad alta precisione. il Package Substrate sarà realizzato con materiali Showa Denko e Ajinomoto High speed. or other high quality base package substrate or PCB boards materials.

High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.