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Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 strati

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 strati,

Top 10 Packaging Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 strato a 20 strati.

Global Packaging Substrate Manufacturer. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.