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Подложка для упаковки FCBGA: Оптимальный шаг выступа 100 мкм, 9гм трассировка и зазор для компактного дизайна. Типичный: 15-30гм трассировка и интервал.

Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.

Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.

BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

We are a professional FCBGA package, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.