News Archives - Page 57 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 57

Semiconductor substrate supplier. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Semiconductor FC BGA substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

We are a professional Semiconductor BGA substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Semiconductor substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.