News Archives - Page 55 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 55

We are a professional Advance Semiconductor substrate manufacturer, we mainly produce ultra-small bump pitch substrate PCBs.

Advance Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Advance Semiconductor substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Advanced packaging substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-flex BGA substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Rigid-flex packaging substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.