News Archives - Page 53 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 53

FCCSP Flip Chip CSP package substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.

Cavity PCB Substrate Manufacturer. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.

Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 layer to 20 layers. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 layer to 30 layers.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.