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Organic Substrate FC BGA substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.

Professional Embedded Cavity Substrate Manufacturer, we mainly produce Embedded Cavity PCB and Embedded Cavity Substrates. to use the BT base and rogers baes or other types High frequency and high speed substrate materials.

FCCSP Flip Chip Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace and spacing are 9um/9um. Use the Ajinomoto(ABF) base material or other types High frequency and high speed substrate materials.

BGA Cavity Substrate Manufacturer. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.

Organic Packaging Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 to 20 layers. and our company also do the Organic Packaging service.

BT FCCSP Package Substrate Manufacturer. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.