News Archives - Page 49 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 49

Top 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 layer to 20 layers.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.

Module Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs from 4 layer to 20 layers.

Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.

CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 to 18 layers.