News Archives - Page 47 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 47

Professional Low CET PCB manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing PCB and package substrate.

Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.

Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.

Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.

Semiconductor BGA substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate

Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.