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BT Epoxy Resin PCB manufacturing, Mini LED BT PCBs and BGA substrates supplier. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.

Micro cavity substrates manufacturing. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 layer to 30 layers. high quality and fast lead times.

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 layer to 30 layers.

Bt laminate substrate manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.

Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.