News Archives - Page 44 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 44

Microvias | Blind Vias PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18.

Embedded slot PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest.

Multi cavity PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap.

Micro via PCB manufacturing. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,

Embedded Components PCB manufacturing, Embedded Cavity PCB, Embedded slot PCB manufacture. Open the cavity on the PCBs. we have made many this cavity PCBs with high quality.

blind-vias-pcb-board. Save your money and time. we produce blind vias holes pcb boards from 6 layer to 50 layers. Higher quality. and we can offer quick turn lead time.