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Embedded Cavity PCB Board. we have produced the embedded cavity pcb with advanced technology.Depth control, high precision Cavity size, we offer the Embedded Cavity PCB from 4 layer to 30 layers.

Micro cavity PCB manufacturing. High speed and high frequency material cavity PCB/packaging substrate manufacturing. Advanced cavity packaging substrate.

BT Epoxy Resin PCB manufacturing, Mini LED BT PCBs and BGA substrates supplier. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.

Micro cavity substrates manufacturing. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 layer to 30 layers. high quality and fast lead times.

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Cavity substrate manufacturing. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 layer to 30 layers.