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Mixed dielectric PCB manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Microvia Substrates manufacturing. the best smallest vias holes size are 50um. the Package Substrate will be made with BT core, Showa Denko and Ajinomoto High speed materials. or other types core materials.

Mini Ceramics PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Embedded IC PCB manufacturing. Open Depth control slot on the PCBs. Put the IC in the slot of the PCBs. we can use the High frequency and high speed materials.

Embedded cavity PCB manufacturing. Open a Depth control cavity on the PCBs. or multi-cavity on the PCBs. we have made many this cavity PCB from 4 layer to 30 layers. to use the High frequency and high speed materials.

Rogers Base PCBs Manufacturer. Rogers base pcbs. More cheaper price. More higher quality. and we can prodcue Rogers base pcb boards from 2 layer to 30 layers. We have made pcb with Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad.