News Archives - Page 48 of 100 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 48

Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,

Top 10 Packaging Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 layer to 20 layers.

Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.