Archivi di notizie - Pagina 60 Di 101 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 60

Substrato di imballaggio. Utilizziamo la tecnologia avanzata Msap e Sap, Substrati di interconnessione multistrato elevati da 4 A 18 strati,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

We are a professional Substrate package technology development Inte, produciamo principalmente substrati a passo d'urto ultra-piccoli, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, produciamo principalmente substrati a passo d'urto ultra-piccoli, ultra-small trace and spacing packaging substrate and PCBs. Nel campo dell'elettronica moderna, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

Siamo substrati professionali per pacchetti di semiconduttori, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. Nel panorama in rapida evoluzione dell’industria elettronica, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…