News Archives - Page 62 of 96 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 62

The FCBGA (Flip Chip Ball Grid Array) packaging substrate is a key component of this technology and plays an indispensable role. FCBGA packaging substrate provides a highly integrated solution that can achieve more functions, higher performance and lower energy consumption in miniaturized electronic devices. This compact packaging method not only…

We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 or 2 days. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 layer to 18 layers. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 layer to 18 layer

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. or 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!