What steps does the packaging substrate process include?
We are a professional Package substrate process, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. In today's digital era, electronic devices gradually penetrate people's daily lives, from smartphones to household appliances, all without advanced electronic manufacturing technology. As the core component of electronic…
Why is the modulus of the packaging substrate important?
Package substrate modulus and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers. Packaging substrates, as an integral part of electronic devices, play a key role. In the wave of modern technology, it undertakes multiple tasks such as supporting electronic…
Why is CTE important for substrate materials?
We are a professional Package substrate material cte, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.
What are the substrate materials for packaging?
We are a professional Package substrate market, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Packaging substrates, as an integral part of modern electronics, play a key role. Its core role is not only limited to providing support and connections for electronic components,…
What is the difference between substrate and package?
Package substrate core. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers. In the contemporary design of electronic equipment, the layout design of packaging substrates assumes a pivotal role, influencing not only the performance and reliability of electronic products but also directly impacting…
What are the key characteristics of package substrate dielectrics?
Package substrate dielectric market, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. In the modern electronics industry, Package Substrate Dielectric plays a vital role. With the continuous development of electronic equipment, the demand for high-performance packaging substrates is growing. As the core component of the…
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com