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Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 слой в 18 слои. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) and Semi-Additive Processes (SAP). To do the traces/spacing with 9um/9um FC BGA packaging substrates.These groundbreaking methodologies have revolutionized PCB production, offering unparalleled capabilities that propel the industry to new heights of innovation and efficiency.

FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 слой в 16 слои. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 слои. The substrates base(основной) materials are the BT base materials. ABF base materials. High frequency and high speed materials. и другие. Our company offer high quality…

Производство подложек для упаковки флип-чипов. 90% нашего производственного оборудования было закуплено в Японии. Мы используем современное производственное оборудование для производства подложек со сверхмалым расстоянием.. Такой как: 10 Слой Пакет Подложки. 12 Подложки пакета слоев. 18 Слой Пакет Подложки. Если спецификация схемы вашей подложки, it is easier to produce a…

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 слой в 18 слои. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…