Trade News Archives - Page 18 of 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD

GPU Substrates Manufacturer
June 22, 2024 Notizie aziendali / Notizia / Notifica / Showcase / Notizie commerciali
GPU Substrates Manufacturer."GPU Substrates Manufacturer" refers to a company specializing in the production of substrates designed specifically for Graphics Processing Units (GPUs). These substrates are crucial components that facilitate efficient electronic interconnections and thermal management within GPU systems, ensuring optimal performance and reliability in high-demand applications such as gaming, artificial…
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ABF GX92R Package Substrates Manufacturer
June 21, 2024 Notizie aziendali / Notizia / Notifica / Showcase / Notizie commerciali
ABF GX92R Package Substrates Manufacturer.ABF GX92R Package Substrates Manufacturer specializes in the production of advanced ABF substrates designed for high-performance semiconductor packaging. Our expertise lies in crafting substrates that ensure superior electrical connectivity and thermal management, meeting the rigorous demands of modern electronics.
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Ultra-thin CPU BGA Substrates Manufacturer
June 20, 2024 Notizie aziendali / Notizia / Notifica / Showcase / Notizie commerciali
Ultra-thin CPU BGA Substrates Manufacturer."Ultra-thin CPU BGA Substrates Manufacturer" refers to a company specializing in the production of ultra-thin Ball Grid Array (BGA) substrates for CPUs. They focus on creating thin, high-density interconnect solutions that enhance performance and efficiency in electronic devices.
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Aviation PCB Manufacturer
June 19, 2024 Notizie aziendali / Notizia / Notifica / Showcase / Notizie commerciali
Aviation PCB Manufacturer."Aviation PCB Manufacturer" refers to a company specializing in the design and production of printed circuit boards (PCB) tailored specifically for aviation applications. These PCBs are engineered to meet stringent industry standards for reliability, durabilità, and performance in aviation electronics, ensuring safe and efficient operation in aerospace systems.
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FC-LGA Package Substrates Manufacturer
June 18, 2024 Notizie aziendali / Notizia / Notifica / Showcase / Notizie commerciali
FC-LGA Package Substrates Manufacturer.As a leading FC-LGA Package Substrates manufacturer, we specialize in producing high-quality substrates designed for Flip Chip Land Grid Array (FC-LGA) applications. Our advanced manufacturing processes ensure optimal performance, superior thermal management, and reliable interconnectivity for high-performance computing, telecommunications, and consumer electronics. We are committed to innovation…
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Chip Package Substrates Manufacturer
June 17, 2024 Notizie aziendali / Notizia / Notifica / Showcase / Notizie commerciali
Chip Package Substrates Manufacturer."Chip Package Substrates Manufacturer" refers to a company specializing in the production of advanced substrates used in chip packaging. They design and manufacture these substrates to ensure optimal performance, reliability, and miniaturization in electronic devices.
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