Trade News Archives - Page 24 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 24

A (MIS) Molded Interconnect Substrate Manufacturer specializes in crafting intricate electronic substrates, integrating circuitry within molded structures. With advanced fabrication techniques, they engineer substrates that combine mechanical support with electrical functionality, optimizing space and performance in electronic devices. These substrates enable compact designs and streamline assembly processes, fostering innovation across…

Uncover cutting-edge possibilities with our Ultrathin PCBs, reshaping electronics through advanced engineering and sleek design.

Rogers 4003C PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate.

Micro LED PCB Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

Cavity Substrate| Package substrate Manufacturer, RF Cavity PCBs, Antenna Cavity PCBs, We offer Cavity PCBs from 4 layer to 50 layers, To use the High frequency and high speed materials, or materials of their type.

Advanced Semiconductor Glass Substrates Manufacturer. we can produce the best samllest bump pitch Glass Substrates with 100um, the best smallest trace and gap are 9um.