Trade News Archives - Page 47 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 47

SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 to 20 layers.

High precision packaging substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other high quality base package substrate or PCB boards materials.

High Frequency package Substrate  Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.

Organic Package Manufacturer. the Package Substrate will be made with BT, Rogers, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.

Organic Substrate FC BGA substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.

Professional Embedded Cavity Substrate Manufacturer, we mainly produce Embedded Cavity PCB and Embedded Cavity Substrates. to use the BT base and rogers baes or other types High frequency and high speed substrate materials.