Trade News Archives - Page 46 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 46

Module Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs from 4 layer to 20 layers.

Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.

CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 to 18 layers.

FC-CSP Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.

High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.

SHDBU Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 to 20 layers.