Organic Packaging Manufacturer
Organic Packaging Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 к 20 слои. and our company also do the Organic Packaging service.
BT FCCSP Package Substrate Manufacturer
BT FCCSP Package Substrate Manufacturer. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.
CSP package substrate Manufacturer
CSP package substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.
Flip Chip CSP Package Substrate Manufacturer
Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.
Wire Bond Substrate Manufacturer
Professional Wire Bond Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and led PCBs from 2 слой в 20 слои.
Cavity Substrate PCB Manufacturer
Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.
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Электронная почта: info@alcantapcb.com