Flip Chip CSP (FCCSP) Firm
Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 слой в 20 слои. we also offer the Flip Chip CSP package service.
What is Ceramic package substrate?
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 слой в 30 слои.
What is a semiconductor BGA substrate?
Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
What is a semiconductor FC BGA substrate?
Semiconductor FC BGA substrate quote. мы можем изготовить самый лучший шаг неровностей с толщиной 100 мкм, лучший наименьший след — 9 мкм.
What is Rigid-Flex BGA Substrate?
We are a professional Rigid-flex BGA substrate quote, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.
What is Rigid-Flex Packaging Substrate?
We are a professional Rigid-flex packaging substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace.
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