Wire Bond Substrate Manufacturer
Professional Wire Bond Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and led PCBs from 2 слой в 20 слои.
Cavity Substrate PCB Manufacturer
Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.
Chip-scale package Manufacturer
Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.
Embedded Cavity PCB Substrate Manufacturer
Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.
FCCSP Flip Chip CSP package substrates Manufacturer
FCCSP Flip Chip CSP package substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.
Cavity PCB Substrate Manufacturer
Cavity PCB Substrate Manufacturer. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.
Тел.: +86 (0)755-8524-1496
Электронная почта: info@alcantapcb.com