Trade News Archives - Page 50 of 94 - ALCANTA TECHNOLOGY(SHENZHEN)CO.,LTD - Page 50

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 layer to 30 layers.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Rigid-flex BGA substrate quote, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace.

We are a professional Semiconductor substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.