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BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

We are a professional FCBGA Packaging, produciamo principalmente substrati a passo d'urto ultra-piccoli, ultra-small trace and PCBs.

We are a professional FCBGA package, produciamo principalmente substrati a passo d'urto ultra-piccoli, ultra-small trace and spacing packaging substrate.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Substrato di imballaggio. Utilizziamo la tecnologia avanzata Msap e Sap, Substrati di interconnessione multistrato elevati da 4 A 18 strati,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.