Trade News Archives - Pagina 54 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 54

Semiconductor FC BGA substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

We are a professional Semiconductor BGA substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Substrato di imballaggio rigido-flex. possiamo produrre il miglior bump pitch con 100um, la migliore traccia più piccola è 9um.

We are a professional Semiconductor substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.

Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.