Trade News Archives - Pagina 62 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 62

In the dynamic realm of contemporary electronics, semiconductor packaging substrates assume a pivotal and irreplaceable role. They serve as the very bedrock of electronic equipment, delivering essential support and protection for intricate circuits. The choice and performance of packaging substrate materials wield a profound influence on the efficacy, dependability, E…

In the rapidly developing electronics field, the importance of organic substrate packaging cannot be ignored. As a core component of electronic equipment, it affects performance, reliability and cost. Organic substrate packaging provides a solid foundation for our devices, allowing us to rely on a variety of innovative electronic products in…

The FCBGA (Flip Chip Ball Grid Array) packaging substrate is a key component of this technology and plays an indispensable role. FCBGA packaging substrate provides a highly integrated solution that can achieve more functions, higher performance and lower energy consumption in miniaturized electronic devices. This compact packaging method not only…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 strato a 18 strati. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

Qual è il pacchetto FC BGA? Guida di riferimento del pacchetto FC BGA. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 strato a 18 strato

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Ad esempio: 10 layer Flip-Chip Package Substrates. 12 strato. 14 strato. or 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…