Trade News Archives - Pagina 63 Di 94 - TECNOLOGIA ALCANTA(SHENZHEN)CO.,LTD - Pagina 63

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. COSÌ. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 strato a 18 strati. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (MSAP) e processi semi-additivi (LINFA). Per eseguire tracce/spaziature con substrati di imballaggio FC BGA da 9um/9um. Queste metodologie innovative hanno rivoluzionato la produzione di PCB, offrendo capacità senza precedenti che spingono il settore a nuovi livelli di innovazione ed efficienza.

FC BGA Packaging Substrate Supplier. We have used the Msap and Sap technology to produce the the smallest Packaging Substrate with 9um gap. and the lines width are 9um too. we can produce the FC BGA Packaging Substrate from 2 strato a 16 strati. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 strati. The substrates base(core) materials are the BT base materials. ABF base materials. High frequency and high speed materials. and others. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Ad esempio: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…